Electronic component mounting apparatus and electronic component mounting method

ABSTRACT

In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention is related to an electronic componentmounting apparatus and an electronic component mounting method, by whichelectronic components are mounted on boards.

[0003] 2. Description of the Related Art

[0004] Conventionally, among electronic components (electronic parts)employed in electronic appliances, such electronic components which aresupplied under such a condition that these electronic components such assemiconductor chips have been stuck onto sticking sheets are packaged,or mounted on boards such as lead frames by mounting apparatus equippedwith exclusively-used pick-up apparatus. In this pick-up apparatus,since chips (semiconductor chips) are required to be picked up in higherprecision by absorbing nozzles in this pick-up apparatus, which thesechips are stuck in a plane-lattice shape onto a sticking sheet held byan electronic components supplying unit, a component image taking camerais required so as to recognize positions of the chips on the stickingsheet.

[0005] Also, while a board on which a chip is packaged is mounted on aboard holding unit for a positioning purpose, in order to secure abetter mounting quality of this chip, such a board image taking camerais required. This board image taking camera is employed so as torecognize a position of the board on the board holding unit, toinvestigate a coating condition of adhesive agent for adhering the chip,and also to confirm a mounting condition after the chip has beenmounted. In other words, in such an electronic component mountingapparatus, under such a condition that two areas of both the electroniccomponent supplying unit and the board holding unit are directed totransporting areas, mounting operations are carried out in such a mannerthat three elements of a mounting head, a component image taking camera,and a board taking camera are relatively transported while these threeelements are mutually cooperated.

[0006] However, in conventionally electronic component mountingapparatus, there are many cases that operations of mounting heads,component image taking cameras, and board image taking cameras providedin both electronic component supplying units and board holding units areconstituted in a series manner within the same cycle, and thus, anoccurrence of loss time cannot be avoided. In this loss time, none ofworks is carried out in the electronic component supplying units and/orthe board holding units. As a result, tact time of electronic componentmounting operation is delayed, so that there is a limitation inimprovements of work efficiencies.

SUMMARY OF THE INVENTION

[0007] Therefore, the present invention has an object to provide anelectronic component mounting apparatus and an electronic componentmounting method, capable of shortening tack time and also capable ofimproving a work efficiency.

[0008] An electronic component mounting apparatus recited in claim 1 isfeatured by such an electronic component mounting apparatus for mountingan electronic component on an electronic component mounting position ofa board, comprising: an electronic component supplying unit forsupplying electronic components by arraying a plurality of theelectronic components in a plane shape; a board holding unit arranged ata position separated from the electronic component supply unit along afirst direction; a mounting head for picking up an electronic componentof the electronic component supplying unit to hold the picked electroniccomponent, and for mounting the held electronic component on anelectronic component mounting position of a board held by the boardholding unit; a mounting head transporting mechanism for transportingthe mounting head between the electronic component supplying unit andthe board holding unit; a first camera for taking an image of the boardheld by the board holding unit; a first camera transporting mechanismfor transporting the first camera over at least the board holding unit;a first recognition processing unit for processing an image taken by thefirst camera so as to acquire an actual position of the electroniccomponent mounting position of the board held by the board holding unit;a second camera for taking an image of the electronic component of theelectronic component supplying unit; a second camera transportingmechanism for transporting the second camera over at least theelectronic component supplying unit; a second recognition processingunit for processing an image of the second camera so as to acquire aposition of the electronic component of the electronic componentsupplying unit; mounting head transporting control means for controllingthe mounting head transporting mechanism so as to execute: (1) apositioning operation of the mounting head in the case that theelectronic component is picked up from the electronic componentsupplying unit based upon the position of the electronic componentacquired by the second recognition processing unit, and also in order toperform: (2) a positioning operation of the mounting head in the casethat the electronic component is mounted on the board of the boardholding unit based upon the actual position of the electronic componentmounting position acquired by the first recognition processing unit;first camera transporting control means for controlling the first cameratransporting mechanism so as to execute: (1) a positioning operation ofthe first camera in the case that an image of the board held by theboard holding unit is taken, and also in order to perform: (2) anevacuating operation for transporting the first camera to a positionwhere mounting of the electronic component by the mounting head is notdisturbed; and second camera transporting control means for controllingthe second camera transporting mechanism so as to execute: (1) apositioning operation of the second camera in the case that an image ofthe electronic component of the electronic component supplying unit istaken, and also in order to perform: (2) an evacuating operation fortransporting the second camera to a position where the pick-up operationof the electronic component by the mounting head is not disturbed.

[0009] An electronic component mounting apparatus recited in claim 2 isfeatured by that the first camera takes an image of the electroniccomponent mounting position of the board so as to acquire an imagethereof, and the first recognition processing unit processes the imagein order to acquire the actual position of the electronic componentmounting position.

[0010] An electronic component mounting apparatus recited in claim 3 isfeatured by that the first camera takes images of both the electroniccomponent mounting position and adhesive agent coated at the electroniccomponent mounting position so as to acquire images thereof; and thefirst recognition processing unit processes the acquired images in orderto acquire the actual position of the electronic component mountingposition and also to investigate a coating condition of adhesive agentcoated at the electronic component mounting position.

[0011] An electronic component mounting apparatus recited in claim 4 isfeatured by that the first camera takes an image of the electroniccomponent mounting position of the board on which the electroniccomponent is mounted to acquire an image thereof; the first recognitionprocessing unit processes the acquired image taken by the first cameraso as to investigate a mounting condition of the electronic component;and the first camera transporting control means causes the first cameratransporting mechanism to execute a positioning operation of the firstcamera in the case that the first camera takes an image of theelectronic component mounting position of the board on which theelectronic component is mounted.

[0012] An electronic component mounting apparatus recited in claim 5 isfeatured by that the mounting head transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the mounting head along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the mounting headalong the second direction guide.

[0013] An electronic component mounting apparatus recited in claim 6 isfeatured by that the first camera transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the first camera along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the first camera alongthe second direction guide.

[0014] An electronic component mounting apparatus recited in claim 7 isfeatured by that the second camera transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a beam member equipped with a second direction guide, bothends of which are supported by the paired first direction guides, andwhich guides the second camera along a second direction locatedperpendicular to the first direction; a first direction drive mechanismfor transporting the beam member along the first direction guides; and asecond direction drive mechanism for transporting the second cameraalong the second direction guide.

[0015] An electronic component mounting apparatus recited in claim 8 isfeatured by that the mounting head transporting mechanism is arranged bycontaining: one pair of first direction guides arranged in parallel tothe first direction and in such a manner that the paired first directionguides sandwich both the electronic component supply unit and the boardholding unit; a center beam member equipped with a second directionguide, both ends of which are supported by the paired first directionguides, and which guides the mounting head along a second directionlocated perpendicular to the first direction; a first direction drivemechanism for transporting the center beam member along the firstdirection guides; and a second direction drive mechanism fortransporting the mounting head along the second direction guide; thefirst camera transporting mechanism includes: a first beam memberequipped with a second direction guide, both ends of which are supportedby the paired first direction guides, and which guides the first cameraalong a second direction located perpendicular to the first direction; afirst direction drive mechanism for transporting the first beam memberalong the first direction guides; and a second direction drive mechanismfor transporting the first camera along the second direction guide; andthe second camera transporting mechanism includes: a second beam memberequipped with a second direction guide, both ends of which are supportedby the paired first direction guides, and which guides the second cameraalong a second direction located perpendicular to the first direction; afirst direction drive mechanism for transporting the second beam memberalong the first direction guides; and a second direction drive mechanismfor transporting the second camera along the second direction guide.

[0016] An electronic component mounting apparatus recited in claim 9 isfeatured by that both a third camera for taking an image of theelectronic component held by the mounting head, and a third recognitionprocessing unit for processing the image taken by the camera so as toacquire a position of the electronic component held by the mounting headare provided between the electronic component supplying unit and theboard holding unit; and the mounting head transporting control meanscontrols the mounting head transporting mechanism so as to execute: (1)a positioning operation of the mounting head in the case that theelectronic component is picked up from the electronic componentsupplying unit based upon the position of the electronic componentacquired by the second recognition processing unit, and also in order toperform: (2) a positioning operation of the mounting head in the casethat the electronic component is mounted on the board of the boardholding unit based upon the actual position of the electronic componentmounting position acquired by the first recognition processing unit, andalso the position of the electronic component acquired by the thirdrecognition processing unit.

[0017] An electronic component mounting apparatus recited in claim 10 isfeatured by that the board holding unit is comprised of a plurality ofboard holding mechanisms for holding boards.

[0018] An electronic component mounting apparatus recited in claim 11 isfeatured by that the electronic component mounting apparatus is furthercomprised of: a board carry-in conveyor for carrying a board in theelectronic component mounting apparatus; a board bring-out conveyor forbringing out a board on which an electronic component has been mountedfrom the electronic component mounting apparatus; a board apportioningunit for receiving boards from the board carry-in conveyor and forapportioning the received boards one by one to the plurality of boardholding mechanisms so as to transport the boards; and a boardreceiving/supplying unit for receiving the boards on which theelectronic components have been mounted from the plurality of boardholding mechanisms and for supplying the received boards to the boardbring-out conveyor.

[0019] An electronic component mounting apparatus recited in claim 12 isfeatured by that the electronic component supplying unit is comprised ofa jig holding unit for detachably holding a jig having a sticking sheeton which a plurality of electronic components have been stuck.

[0020] An electronic component mounting apparatus recited in claim 13 isfeatured by that a sticking sheet exfoliating mechanism for exfoliatingan electronic component picked up by the mounting head from the stickingsheet is provided under the sticking sheet.

[0021] An electronic component mounting apparatus recited in claim 14 isfeatured by that the mounting head is equipped with a plurality ofnozzles which each holds one of the electronic components, and ismovable under such a condition that the plurality of electroniccomponents are held.

[0022] An electronic component mounting method recited in claim 15 isfeatured by that in an electronic component mounting method executed byan electronic component mounting apparatus comprising: a mounting headfor picking up an electronic component of an electronic componentsupplying unit to hold the picked electronic component, and for mountingthe held electronic component on an electronic component mountingposition of a board held by a board holding unit; a mounting headtransporting mechanism for transporting the mounting head between theelectronic component supplying unit and the board holding unit; a firstcamera for taking an image of the board held by the board holding unit;a first camera transporting mechanism for transporting the first cameraover at least the board holding unit; a first recognition processingunit for processing an image taken by the first camera so as to acquirean actual position of the electronic component mounting position of theboard held by the board holding unit; a second camera for taking theelectronic component of the electronic component supplying unit; asecond camera transporting mechanism for transporting the second cameraover at least the electronic component supplying unit; a secondrecognition processing unit for processing an image of the second cameraso as to acquire a position of the electronic component of theelectronic component supplying unit; the electronic mounting method iscomprised of:

[0023] a first step in which the second camera is transported to theelectronic component supplying unit by the second camera transportingmechanism to take an image of an electronic component, and thereafterthe second camera is evacuated from an upper area of the electroniccomponent by the second camera transporting mechanism; a second step inwhich an image taken by the second camera is processed by the secondrecognition processing unit so as to acquire a position of theelectronic component; a third step in which while the mounting headtransporting mechanism executes a positioning operation for positioningthe mounting head to the electronic component based upon the position ofthe electronic component acquired by the second recognition processingunit, the electronic component is picked up by the mounting head; afourth step in which the first camera is transported by the first cameratransporting mechanism over a board held by the board holding unit so asto take an image of the board by the first camera, and thereafter thefirst camera is evacuated from an upper area of the board by the firstcamera transporting mechanism; a fifth step in which the image taken bythe first camera is processed by the first recognition processing unitso a to acquire an actual position of the electronic component mountingposition of the board; and a sixth step in which while the mounting headtransporting mechanism executes a positioning operation for positioningthe mounting head to the electronic component mounting position basedupon the actual position of the electronic component mounting positionacquired by the first recognition processing unit, the electroniccomponent held by the mounting head is mounted on the electroniccomponent mounting position; wherein: while the electronic componentheld by the mounting head is mounted on the electronic componentmounting position, the second camera is again transported over theelectronic component supporting unit so as to take an image of anelectronic component which is subsequently picked up by the secondcamera.

[0024] An electronic component mounting method recited in claim 16 isfeatured by that the first camera takes the electronic componentmounting position of the board so as to acquire an image thereof in thefourth step, and the first recognition processing unit processes theimage in order to acquire the actual position of said electroniccomponent mounting position in the fifth step.

[0025] An electronic component mounting method recited in claim 17 isfeatured by that the first camera takes both the electronic componentmounting position and adhesive agent coated at the electronic componentmounting position so as to acquire images thereof in the fourth step;and the first recognition processing unit processes the acquired imagesin order to acquire the actual position of the electronic componentmounting position and also to investigate a coating condition ofadhesive agent coated at the electronic component mounting position inthe fifth step.

[0026] An electronic component mounting method recited in Clam 18 isfeatured by that the electronic component mounting method is furthercomprised of: a seventh step in which the first camera transportingmechanism transports the first camera over an electronic componentmounting position of the board on which the electronic component hasbeen mounted so as to take the electronic component mounting position;and an eighth step in which the image taken in the seventh step isprocessed by the first recognition processing unit so as to investigatea mounting condition of the electronic component.

[0027] An electronic component mounting method recited in claim 19 isfeatured by that the subsequent fourth step is continuously carried outafter the seventh step.

[0028] An electronic component mounting method recited in claim 20 isfeatured by that in an electronic component mounting method executed byan electronic component mounting apparatus comprising: a mounting headfor picking up an electronic component of an electronic componentsupplying unit to hold the picked electronic component, and for mountingthe held electronic component on an electronic component mountingposition of a board held by a board holding unit; a mounting headtransporting mechanism for transporting the mounting head between theelectronic component supplying unit and the board holding unit; a firstcamera for taking an image of the board held by the board holding unit;a first camera transporting mechanism for transporting the first cameraover at least the board holding unit; a first recognition processingunit for processing an image taken by the first camera so as to acquirean actual position of the electronic component mounting position of theboard held by the board holding unit; a second camera for taking animage of the electronic component of the electronic component supplyingunit; a second camera transporting mechanism for transporting the secondcamera over at least the electronic component supplying unit; a secondrecognition processing unit for processing an image of the second cameraso as to acquire a position of the electronic component of theelectronic component supplying unit;

[0029] the electronic mounting method is comprised of: a first step inwhich the second camera is transported to the electronic componentsupplying unit by the second camera transporting mechanism to take animage of a plurality of electronic components, and thereafter the secondcamera is evacuated from an upper area of the plural electroniccomponents by the second camera transporting mechanism; a second step inwhich images taken by the second camera are processed by the secondrecognition processing unit so as to acquire positions of the pluralelectronic components; a third step in which while the mounting headtransporting mechanism executes a positioning operation for sequentiallypositioning the mounting head to the plural electronic components basedupon the positions of the plural electronic components acquired by thesecond recognition processing unit, the plural electronic components aresequentially picked up by the mounting head; a fourth step in which thefirst camera is transported by the first camera transporting mechanismover a board held by the board holding unit so as to take an image ofthe board by the first camera, and thereafter the first camera isevacuated from an upper area of the board by the first cameratransporting mechanism; a fifth step in which the image taken by thefirst camera is processed by the first recognition processing unit so ato acquire actual positions of the plural electronic component mountingpositions of the board; and a sixth step in which while the mountinghead transporting mechanism executes a positioning operation forsequentially positioning the mounting head to the plural electroniccomponent mounting positions based upon the positions of the pluralelectronic component mounting positions acquired by the firstrecognition processing unit, the plural electronic components held bythe mounting head are sequentially mounted on the plural electroniccomponent mounting positions; wherein: while the electronic componentsheld by the mounting head are sequentially mounted on the pluralelectronic component mounting positions, the second camera is againtransported over the electronic component supporting unit so as to takean image of a plurality of electronic components which are subsequentlypicked up by the second camera.

[0030] An electronic component mounting method recited in claim 21 isfeatured by that the first camera takes images of a plurality ofelectronic component mounting positions of the board so as to acquireimages thereof in the fourth step, and the first recognition processingunit processes the images in order to acquire the actual positions ofthe plural electronic component mounting positions in the fifth step.

[0031] An electronic component mounting method recited in claim 22 isfeatured by that the first camera takes images of both the pluralelectronic component mounting positions and adhesive agent coated at theplural electronic component mounting positions so as to acquire imagesthereof in the fourth step; and the first recognition processing unitprocesses the acquired images in order to acquire the actual positionsof the plural electronic component mounting positions and also toinvestigate coating conditions of adhesive agent coated at the pluralelectronic component mounting positions in the fifth step.

[0032] An electronic component mounting method recited in claim 23 isfeatured by that the electronic component mounting method is furthercomprised of: a seventh step in which the first camera transportingmechanism transports the first camera over a plurality of electroniccomponent mounting positions of the board on which the electroniccomponents have been mounted so as to take images of the pluralelectronic component mounting positions; and an eighth step in which theimages taken in the seventh step are processed by the first recognitionprocessing unit so as to investigate mounting conditions of the pluralelectronic components.

[0033] An electronic component mounting method recited in claim 24 isfeatured by that the subsequent fourth step is continuously carried outafter the seventh step.

[0034] In accordance with the present invention, while the electroniccomponent mounting apparatus is provided with the mounting headtransporting mechanism for transporting the mounting head whichmounts/transports the electronic component between the electroniccomponent supplying unit and the board holding unit; the first cameratransporting mechanism for transporting the first camera which takes animage of the board in the board holding unit over at least the boardholding unit; and the second camera transporting mechanism fortransporting the second camera which takes an image of the electroniccomponent of the electronic component supplying unit over at least theelectronic component supplying unit, since both the electronic componentsupplying unit and the board holding unit are defined as the range to betransported, and the mounting head, the first camera, and the secondcamera are relatively traveled in conjunction to each other, theoccurrence of loss time in both the electronic component supplying unitand the board holding unit can be avoided, and the tact time can beshortened to improve the work efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

[0035]FIG. 1 is a plan view for indicating an electronic componentmounting apparatus according to one embodiment mode of the presentinvention;

[0036]FIG. 2 is a side/sectional view for showing the electroniccomponent mounting apparatus of one embodiment mode of the presentinvention;

[0037]FIG. 3 is a plan/sectional view for showing the electroniccomponent mounting apparatus of one embodiment mode of the presentinvention;

[0038]FIG. 4 is a block diagram for indicating an arrangement of acontrol system of the electronic component mounting apparatus accordingto one embodiment mode of the present invention;

[0039]FIG. 5 is a functional block diagram for showing a processingfunction of the electronic component mounting apparatus according to oneembodiment mode of the present invention;

[0040]FIGS. 6A and 6B are explanatory diagrams for explaining processsteps of an electronic component mounting method according to anembodiment mode of the present invention;

[0041]FIGS. 7A and 7B are explanatory diagrams for explaining processsteps of the electronic component mounting method according to theembodiment mode of the present invention;

[0042]FIGS. 8A and 8B are explanatory diagrams for explaining processsteps of the electronic component mounting method according to theembodiment mode of the present invention;

[0043]FIGS. 9A and 9B are explanatory diagrams for explaining processsteps of the electronic component mounting method according to theembodiment mode of the present invention; and

[0044]FIGS. 10A, 10B, 10C, and 10D are plan views for indicating a boardto which an electronic component is mounted, according to an embodimentmode of the present invention.

[0045] In the figures, a reference numeral 2 refers to an electroniccomponent supplying unit; 3 to a jig holder; 4 to a jig; 5 to a stockingsheet; 6 to a chip; 7 to an ejector-XY-table; 8 to an ejector; 10 to aboard holding unit; 10A to a first board holding mechanism; 10B to asecond board holding mechanism; 12 to a board carry-in conveyor; 14 to aboard bring-out conveyor; 15 to a third camera; 16 to a board; 16 a toan electronic component mounting position; 17 to an adhesive agent; 30to a center beam member; 31 to a first beam member; 32 to a second beammember; 33 to a mounting head; 34 to a first camera; 35 to a secondcamera; 50 to a mechanism driving unit; 53 to a data storage unit; 54 toa control unit; 55 to a first recognition processing unit; 56 to asecond recognition processing unit; and 57 to a third recognitionprocessing unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] Referring now to drawings, embodiment modes of the presentinvention will be described. FIG. 1 is a plan view for showing anelectronic component mounting apparatus according to one embodiment modeof the present invention, FIG. 2 is a side/sectional view forrepresenting the electronic component mounting apparatus according toone embodiment mode of the present invention, and FIG. 3 is aplan/sectional diagram for indicating the electronic component mountingapparatus according to one embodiment mode of the present invention.FIG. 4 is a block diagram for indicating an arrangement of a controlsystem of the electronic component mounting apparatus according to oneembodiment mode of the present invention, and FIG. 5 is a functionalblock diagram for showing process functions of the electronic componentmounting apparatus according to one embodiment mode of the presentinvention. FIGS. 6A and 6B, FIGS. 7A and 7B, FIGS. 8A and 8B, and FIGS.9A and 9B are explanatory diagrams for explaining process steps of anelectronic component mounting method according to one embodiment mode ofthe present invention, and FIGS. 10A, 10B, 10C, and 10D are plan viewsfor representing boards on which electronic components will be mounted,according to one embodiment mode of the present invention.

[0047] First, an overall construction of an electronic componentmounting apparatus will now be described with reference to FIG. 1, FIG.2, and FIG. 3. FIG. 2 is the sectional view for indicating thiselectronic component mounting apparatus, taken along an arrow A-A ofFIG. 1, and FIG. 3 is the sectional view of representing this electroniccomponent mounting apparatus, taken along an arrow B-B of FIG. 1. InFIG. 1, an electronic component supplying unit 2 is arranged on a baseboard 1. As shown in FIG. 2 and FIG. 3, the electronic componentsupplying unit 2 is equipped with a jig holder (jig holding unit) 3. Thejig holder 3 detachably holds a jig 4 on which a sticking sheet 5 ismounted. Semiconductor chips 6 (will be simply abbreviated as “chips 6”hereinafter) corresponding to electronic components (electronic parts)are stuck on the sticking sheet 5 under such a condition that thesechips 6 are individually separated from each other. Under such acondition that the jig 4 is held by the jig holder 3, the electroniccomponent supplying unit 2 supplies the chips 6 by arranging a pluralityof semiconductor chips in a plane shape.

[0048] As indicated in FIG. 2, an ejector 8 is arranged under thesticking sheet 5 held by the jig holder 3 in such a manner that thisejector 8 can be horizontally transported by an ejector-XY-table 7. Theejector 8 is equipped with a pin elevation mechanism for elevating achip-raising ejector pin (not shown). In the case that the chips 6 arepicked up from the sticking sheet 5 by a mounting head (will beexplained later), the chips 6 are raised from the lower portion of thesticking sheet 5 by the ejector pin, so that the chips 6 are exfoliatedfrom the sticking sheet 5. The ejector 8 constitutes a sticking sheetexfoliating mechanism for exfoliating the chips 6 form the stickingsheet 5.

[0049] As shown in FIG. 3, a board holding unit 10 is arranged at such aposition separated from the electronic component supplying unit 2provided on the upper plane of the base board 1 along a Y direction(namely, first direction). On the upper stream side and the lower streamside of the board holding unit 10, a board carry-in conveyor 12, a boardapportioning unit 11, a board holding unit 10, a boardreceiving/supplying unit 13, and a board bring-out conveyor 14 arearranged in a series manner along an X direction. The board carry-inconveyor 12 is arranged in such a manner that the board carry-inconveyor 12 rides on a sub-board base 1 a coupled to the board base 1.An adhesive agent coating apparatus 9 is arranged on the sub-board base1 a. The adhesive agent coating apparatus 9 coats adhesive agent 17 (seeFIGS. 10A to 10D) for adhering the chips 6 by a coating head 9 a withrespect to a board 16 which has been carried in the board carry-inconveyor 12 from the upper stream side.

[0050] The board 16 on which the adhesive agent has been coated istransported to the board apportioning unit 11. The board apportioningunit 11 is constructed in such a manner that an apportioning conveyor 11a can be slid along the Y direction by a slide mechanism 11 b. Thisboard apportioning unit 11 selectively apportions the boards 16 receivedfrom the board carry-in conveyor 12 to two sets of board holdingmechanisms (will be explained later) of the board holding unit 10. Theboard holding unit 10 is provided with a first board holding unit 10Aand a second board holding unit 10B. This board holding unit 10 holdsthe board 16 apportioned by the board apportioning unit 11 so as toposition this held board 16 at a mounting position.

[0051] The board receiving/supplying unit 13 is arranged in such amanner that a receiving/supplying conveyor 13 a can be slid by a slidemechanism 13 b along the Y direction similar to the board apportioningunit 11. The receiving/supplying conveyor 13 c is selectively connectedto a first board holding mechanism 10A and a second board holdingmechanism 10B, so that this receiving supplying conveyor 13 a receivesthe board 16 on which the chips 6 have been packaged, and then suppliesthis received board 16 to the board bring-out conveyor 14. The boardbring-out conveyor 14 brings out the supplied board 16 on which thechips 6 have been mounted to the down stream side.

[0052] In FIG. 1, both a first Y-axis base 20A and a second Y-axis base20B are arranged on both edge portions of an upper plane of the baseboard 1 in such a manner that longitudinal directions of the first andsecond Y-axis bases 20A/20B are directed to the Y direction (firstdirection) located perpendicular to the board carrying direction (Xdirection). A pair of first direction guide 21 are arranged on an upperplane of the first Y-axis base 20A and an upper plane of the secondX-axis base 20B in such a manner that the first direction guides 21 arelocated substantially over entire lengths thereof along a longitudinaldirection (Y direction), and one pair of these first direction guides 21are positioned in parallel thereto and also sandwich both the electroniccomponent supplying unit 2 and the board holding unit 10.

[0053] Three sets of beam members (namely, a first beam member 31, acenter beam member 30, and a second beam member 32) are suspended bythese paired first direction guides 21 in such a manner that both edgeportions of each of these three beam members 30, 31, 32 are supported bythe first direction guides 21 and can be freely slid along the Ydirection.

[0054] A nut member 23 b is projected on a side edge portion of a rightside of this center beam member 30, and a feed screw 23 a meshed withthe nut member 23 b is rotated by a Y-axis motor 22 which is arranged onthe first Y-axis base 20A along the horizontal direction. Since theY-axis motor 22 is driven, the center beam member 30 is horizontallytransported along the Y-direction along the first direction guides 21.

[0055] Also, nut members 25 b and 27 b are projected on side edgeportions of left sides of the first beam member 31 and the second beammember 32. Feed screws 25 a and 27 a which are meshed to these nutmembers 25 b and 27 b are rotated by Y-axis motors 24 and 26, which arearranged on the second Y-axis base 20B respectively along the horizontaldirection. Since the Y-axis motors 24 and 26 are driven, both the firstbeam member 31 and the second beam member 32 are horizontallytransported in the Y direction along the first direction guides 21.

[0056] A mounting head 33 is mounted on the center beam member 30, and afeed screw 41 a which is meshed with a nut member 41 b coupled to thismounting head 33 is rotated by an X-axis motor 40. Since the X-axismotor 40 is driven, the mounting head 33 is guided by a second directionguide (see FIG. 2) so as to be transported along the X direction. Thissecond direction guide 42 is provided on a side plane of the center beammember 30.

[0057] The mounting head 33 is provided with plural sets (four sets inthis case) of nozzles 33 a for holding one piece of chip 6. The mountinghead 33 may be transported under such a condition that each of the chips6 is absorbed by each of the nozzles 33 a, and a plurality of chips 6are held. Since both the Y-axis motor 22 and the X-axis motor aredriven, the mounting head 33 is horizontally transported along the Xdirection and the Y direction, picks up the chips 6 of the electroniccomponent supplying unit 2, and then, mounts the held chips 6 on anelectronic component mounting position 16 a of the board 16 held by theelectronic component supplying unit 2.

[0058] One pair of the first direction guides 21, the center beam member30, a first direction drive mechanism (namely, Y-axis motor 22, feedscrew 23 a, and nut member 23 b), and also a second director drivemechanism (namely, X-axis motor 40, feed screw 41 a, and nut member 41b) constitute a mounting head transporting mechanism for transportingthe mounting head 33 between the electronic component supplying unit 2and the board holding unit 10. The first direction drive mechanismtransports the center beam member 30 along the first direction guides21, whereas the second direction drive mechanism transports the mountinghead 33 along the second direction guide 42.

[0059] A first camera 34 is mounted on the first beam member 31, and anut member 44 b is coupled to a bracket 34 a for holding this firstcamera 34. A feed screw 44 a meshed with the nut member 44 b is rotatedby an X-axis motor 43. Since the X-axis motor 43 is driven, the firstcamera 34 is guided by a second direction guide 45 (see FIG. 2) providedon a side plane of the first beam member 31 so as to be transportedalong the X-direction.

[0060] Since both the Y-axis motor 24 and the X-axis motor 43 aredriven, the first camera 34 is horizontally transported along the Xdirection and the Y direction. As a result, the first camera 34 can betransported over the board holding unit 10 and also can be transportedso as to be evacuated from the board holding unit 10 in order that thisfirst camera 34 images, or takes an image of the board 16 which is heldby the first board holding mechanism 10A and the second board holdingmechanism 10B of the board holding unit 10.

[0061] One pair of the first direction guides 21, a first beam member31, a first direction drive mechanism (namely, Y-axis motor 24, feedscrew 25 a, and nut member 25 b), and also a second direction drivemechanism (namely, X-axis motor 43, feed screw 44 a, and nut member 44b) constitute a first camera transporting mechanism for transporting atleast the first camera 34 over the board holding unit 10. The firstdirection drive mechanism transports the first beam member 31 along thefirst direction guides 21, whereas the second direction drive mechanismtransports the first camera 34 along the second direction guide 45.

[0062] A second camera 35 is mounted on the second beam member 32, and anut member 47 b is coupled to a bracket 35 a for holding this secondcamera 35. A feed screw 47 a meshed with the nut member 47 b is rotatedby an X-axis motor 46. Since the X-axis motor 46 is driven, the secondcamera 35 is guided by a second direction guide 48 (see FIG. 2) providedon a side plane of the second beam member 32 so as to be transportedalong the X-direction.

[0063] Since both the Y-axis motor 26 and the X-axis motor 46 aredriven, the second camera 35 is horizontally transported along the Xdirection and the Y direction. As a result, the second camera 35 can betransported over the electronic component supplying unit 2 and also canbe transported so as to be evacuated from the electronic componentsupplying unit 2 in order that this second camera 35 takes images of thechips 6 held by the electronic component supplying unit 2.

[0064] One pair of the first direction guides 21, a second beam member32, a first direction drive mechanism (namely, Y-axis motor 26, feedscrew 27 a, and nut member 27 b), and also a second direction drivemechanism (namely, X-axis motor 46, feed screw 47 a, and nut member 47b) constitute a second camera transporting mechanism for transporting atleast the second camera 35 over the electronic component supplying unit2. The first direction drive mechanism transports the second beam member32 along the first direction guides 21, whereas the second directiondrive mechanism transports the second camera 35 along the seconddirection guide 48.

[0065] As indicated in FIG. 3, a third camera 15 is arranged between theelectronic component supplying unit 2 and the board holding unit 10.Since the mounting head 33 which has picked up the chip 6 is transportedover the third camera 15 in the electronic component supplying unit 2,the third camera 15 takes images of the chips 6 held on the mountinghead 33.

[0066] Referring now to FIG. 4, an arrangement of a control system of anelectronic component mounting apparatus will be explained. In FIG. 4, amechanism driving unit 50 is arranged by a motor driver forelectronically driving motors of the below-mentioned respectivemechanisms, and a control appliance for controlling air pressuresupplied to air cylinders of the respective mechanisms. Since thismechanism driving unit 50 is controlled by a control unit 54, thebelow-mentioned respective drive elements.

[0067] Both the X-axis motor 40 and the Y-axis motor 22 drive a mountinghead transport mechanism for transporting the mounting head 33. Both theX-axis motor 43 and the Y-axis motor 24 drive the first cameratransporting mechanism for transporting the first camera 34, and boththe X-axis motor 46 and the Y-axis motor 26 drive the second cameratransporting mechanism for transporting the second camera 35.

[0068] Also, the mechanism driving unit 50 drives an elevating mechanismof the mounting head 33, and a component absorbing mechanism constructedof nozzles 33 a (see FIG. 2), drives an elevating cylinder of theejector 8, and also a drive motor of the ejector-XY table 7.Furthermore, the mechanism driving unit 50 drives the board carry-inconveyor 12, the board bring-out conveyor 14, the board apportioningunit 11, the board receiving/supplying unit 13, the first board holdingmechanism 10A, and the second board holding mechanism 10B.

[0069] A first recognition processing unit 55 processes an image takenby the first camera 34 to acquire a position of an electronic componentmounting position 16 a (see FIGS. 10A to 10D) of the board 16 held bythe board holding unit 10. The electronic component mounting position 16a indicates a mounting position of a chip 6 on the board 16, from whichthe position can be detected by the image recognition. Also, the firstrecognition processing unit 55 processes the image taken by the firstcamera 34 so as to check a coating condition of an adhesive agent 17coated at the electronic component mounting position 16 a, and furtherso as to check a mounting condition of the chip 6 mounted on theadhesive agent 17.

[0070] A second recognition processing unit 56 processes an image takenby the second camera 35 in order to acquire a position of a chip 6 ofthe electronic component supplying unit 2. A third recognitionprocessing unit 57 processes an image taken by the third camera 15 so asto acquire a position of a chip 6 mounted on the mounting head 33.

[0071] The recognition results obtained from the first recognitionprocessing unit 55, the second recognition processing unit 56, and thethird recognition processing unit 57 are supplied to the control unit54. A data storage unit 53 stores thereinto various sorts of data suchas investigation results, namely, coating condition investigation of theadhesive agent 17 and mounting condition investigation of the chips 6(will be explained later). An operation unit 51 corresponds to an inputapparatus such as a keyboard and a mouse, and enters data and a controlcommand. A display unit 52 displays thereon imaging screens produced bythe first camera 34, the second camera 35, and the third camera 15, andalso displays thereon a guide screen when an input operation isperformed by the operation unit 51.

[0072] Next, a description will now be made of processing functions ofthe electronic component mounting apparatus with reference to FIG. 5. InFIG. 5, a broken line frame 54 indicates a processing function executedby the control unit 54 shown in FIG. 4. In this case, processingfunctions executed by a first camera transporting process unit 54 a, asecond camera transporting process unit 54 b, and a mounting headtransporting process unit 54 c constitute a first camera transportingcontrol means, a second camera transporting control means, and amounting head transporting control means, respectively.

[0073] The first camera transporting process unit 54 a controls thefirst camera transporting mechanism so as to execute a positioningoperation of the first camera 34 when an image of the board 16 held bythe board holding unit 10 is taken by this first camera 34, and alsoexecute such an evacuating operation that the first camera 34 is movedto a position which does not disturb mounting operation of the chips 6by the mounting head 33. In this case, three different sorts of theboard 16 are carried out, namely an image of the electronic componentmounting position 16 a before the chips 6 are mounted is taken; an imageof the adhesive agent 17 contained in the electronic component mountingposition 16 a before the chips 6 are mounted is taken; and also, animage of the electronic component mounting position 16 a after the chipshave been mounted is taken.

[0074] The second camera transporting process unit 54 b controls thesecond camera transporting mechanism so as to execute a positioningoperation of the second camera 35 when an image of the chip 6 of theelectronic component supplying unit is taken by this second camera 35,and also to execute such an evacuating operation that the second camera35 is moved to a position which does not disturb picking-up operation ofan electronic component by the mounting head 33.

[0075] The mounting head transporting process unit 54 c is provided withtwo processing functions of a pick-up operation processing unit 54 d anda mount operation processing unit 54 e. The pick-up operation processingunit 54 d controls the mounting head transporting mechanism so as toexecute a positioning operation of the mounting head 33 in the case thatthe chips 6 are picked up from the electronic component supplying unit 2based upon positions of the chips 6 acquired by the second recognitionprocessing unit 56. The mount operation processing unit 54 e controlsthe mounting head transporting mechanism so as to execute a positioningoperation of the mounting head 33 in the case that the chips 6 aremounted on the board 16 of the board holding unit 10 based uponpositions of the chips 6 acquired by the third recognition processingunit 57, and a position of the electronic component mounting position 16a acquired by an electronic component mounting position detectingprocess unit 55 a of the first recognition processing unit 55.

[0076] The first recognition processing unit 55 contains a coatingcondition investigation processing unit 55 b and a mounting conditioninvestigation processing unit 55 c other than the above-describedelectronic component mounting position detection processing unit 55 a.While the mount operation processing unit 54 e executes the mountingoperation, the mounting operation of a chip 6 is carried out only as tosuch an electronic component mounting position whose coating conditionis judged as “good” by referring to a result of adhesive agent coatinginvestigation of the chip 6, which is detected by the coating conditioninvestigation processing unit 55 b.

[0077] As a result of the above-described adhesive agent coatingcondition investigation obtained by the coating condition investigationprocessing unit 55 b, an investigation result recording process unit 54f executes a process operation used to store the mounting conditioninvestigation results of the chips 6 obtained by the mounting conditioninvestigation processing unit 55 c. The data of these investigationresults are supplied to the investigation result recording process unit54 f so as to be processed, and then, the processed data are stored intothe investigation result storage unit 53 a provided in the data storageunit 53.

[0078] While this electronic component mounting apparatus is arranged inaccordance with the above-described manner, an electronic componentmounting method will now be explained with reference to FIG. 6A to FIG.10D. In FIGS. 6A and 6B, a large number of chips 6 have been stuck ontothe sticking sheet 5 of the jig 4 held by the electronic componentsupplying unit 2. Also, the boards 16 are positioned on the first boardholding mechanism 10A and the second board holding mechanism 10B,respectively, in the board holding unit 10. In this electronic componentmounting method shown in this drawing, a plurality (four pieces in thiscase) of chips 6 are sequentially absorbed and held by four sets of theabsorbing nozzles 33 a provided on the mounting head 33, and then, thesefour chips 6 are sequentially mounted on a plurality of electroniccomponent mounting positions 16 a within one mounting turn.

[0079] First, as shown in FIG. 6A, the second camera 35 is transportedover the electronic component supplying 2 by the second cameratransporting mechanism, and then, images of a plurality (four pieces) ofchips 6 which will be picked up are taken by the second camera 35.Thereafter, as shown in FIG. 6B, the second camera 35 is evacuated fromthe upper areas of these six chips 6. Then, images taken by the secondcamera 35 are processed by the second recognition processing unit 56 soas to acquire positions of the plural chips 6.

[0080] Next, the mounting head 33 is moved over the electronic componentsupplying unit 2. Then, while such a positioning operation is carriedout by the mounting head transporting mechanism, a plurality of chips 6are sequentially picked up by the four absorbing nozzles 33 a of themounting head 33. In this positioning operation, the mounting head 33 issequentially positioned onto these chips 6 based upon the acquiredpositional data of these plural chips 6.

[0081] In conjunction with this pick-up operation, the first camera 34is transported over the board 16 held by the first board holdingmechanism 10A of the board holding unit 10 by the first cameratransporting mechanism. Then, as shown in FIG. 10A, the first camera 34is sequentially transported in such a manner that an image acquisitionrange 18 sequentially surrounds four sets of left-sided electroniccomponent mounting positions 16 a among eight sets of electroniccomponent mounting positions 16 a which are set to the board 16, andthen, this first camera 34 takes images of a plurality of theseelectronic component mounting positions 16 a and the adhesive agent 17coated inside these electronic component mounting positions 16 a.Thereafter, the first camera 34 is evacuated from the upper area of thisboard 16.

[0082] Then, the images of the image acquisition range 18 taken by thefirst camera 34 are processed by the first recognition processing unit55 so as to acquire actual positions of the electronic componentmounting positions 16 a (see FIG. 10A) of the board 16. While this board16 is recognized, an image of the adhesive agent 17 coated inside aplurality of electronic component mounting positions 16 a before thechips 6 have been mounted is taken by the first camera 34 in connectionwith the position detections of the electronic component mountingpositions 16 a, so as to investigate coating conditions of the adhesiveagent 17 coated on the respective electronic component mountingpositions 16 a. In other words, a judgment is made as to whether or notsuch an adhesive agent 17 having a proper coating amount has been coatedat a correct coating position.

[0083] Next, as shown in FIG. 7A, the mounting head 33 in which the fourchips 6 are held by the respective absorbing nozzles 33 a is transportedover the third camera 15, namely performs a scanning operation. As aresult, images of the chips 6 held by the respective absorbing nozzles33 a are acquired by the third camera 15. Since this acquired image isrecognition-processed by the third recognition processing unit 57,actual positions of these chips 6 may be detected.

[0084] Subsequently, this scanning operation is advanced to a mountingoperation. At this time, mounting operations of the chip 6 are carriedout as to only such electronic component mounting positions 16 a whichhave been judged as the good coating conditions by the first recognitionprocessing unit 55. As represented in FIG. 7B, the mounting head 33 istransported over the board holding unit 10 as shown in FIG. 7B. Then, inthis case, the mounting operation is carried out based upon thepositions of the electronic component mounting positions 16 a acquiredby the first recognition processing unit 55, the positions of the chips6 acquired by the third recognition processing unit 57, and the judgmentresult by investigating the coating conditions.

[0085] In other words, while the mounting head transporting mechanismexecutes such a positioning operation, the chips 6 held by the mountinghead 33 are mounted one by one on the adhesive agent 17 coated insidesuch electronic component mounting positions 16 a whose coatingconditions have been judged as “good.” In this positioning operation,the chips 6 held by the absorbing nozzles 33 a of the mounting head 33are sequentially positioned onto such electronic component mountingpositions 16 a whose coating conditions have been judged as “good” amonga plurality of electronic component mounting positions 16 a of the board16 positioned on the first board holding mechanism 10A.

[0086] Then, when the mounting head 33 mounts the chips, the secondcamera 35 is transported over a plurality of chips 6 which aresubsequently picked up in the electronic component supplying unit 2, andthen, the plural chips 6 are taken by the second camera 35. Then, asindicated in FIG. 8A, the second camera 35 is evacuated from the upperarea of these plural chips 6 and thereafter, the mounting head 33 istransported over the electronic component supplying unit 2. Then, whilethe mounting head transporting mechanism performs such a positioningoperation for positioning the mounting head 33 to this chip 6 based uponthe positions of the chips 6 acquired by the second recognitionprocessing unit 56, a plurality of chips 6 are sequentially picked up bythe four absorbing nozzles 33 a of the mounting head 33.

[0087] Then, while the chips 6 are picked upon in the electroniccomponent supplying unit 2, the first camera 34 is transported over thefirst board holding mechanism 10A of the board holding unit 10 so as totake an image of the board 16. In this case, the followinginvestigation/detection are carried out. That is, mounting conditions ofthe chips 6 mounted on the board 16 are investigated; positions of aplurality of electronic component mounting positions 16 a are detectedon which the chips 6 are mounted in a next mounting turn; and coatingconditions of adhesive agent 17 coated on these electronic componentmounting positions 16 a are investigated.

[0088] In other words, as shown in FIG. 10C, in this image takingoperation, the first camera 34 is sequentially transported so as toacquire images in such a manner that eight sets of electronic componentmounting positions 16 a set to the board 16 are sequentially surroundedby the image acquisition range 18. Thereafter, this first camera 34 isevacuated from the upper area of this board 16. Then, the images takenby the first camera 34 are processed by the first recognition processingunit 55, and a next investigation process operation is carried out.

[0089] First, as to images of four sets of left-sided image acquisitionranges 18, mounting conditions of the chips 6 are investigated. That isto say, a check is made as to whether or not positions/attitudes of thechips 6, and sticking-out conditions of the adhesive agent 17 are normalconditions. Then, as to four sets of right-sided image acquisitionranges 18, positions of the electronic component mounting positions 16 aof the board 16 are detected, and also, coating conditions of theadhesive agent 17 coated inside the electronic component mountingpositions 16 a before the chips 6 are mounted are investigated.

[0090] Next, as indicated in FIG. 8B, the mounting head 33 in which thefour chips 6 have been held by the respective absorbing nozzles 33 a ismoved over the third camera 15, namely performs a scanning operation. Asa result, images of the chips 6 held by the respective absorbing nozzles33 a are acquired by the third camera 15, and then, these acquiredimages are processed by the third recognition processing unit 57, sothat actual positions of these four chips may be detected.

[0091] Thereafter, as indicated in FIG. 9A, the mounting head 33 istransported over the first board holding mechanism 10A of the boardholding unit 10. Next, similar to FIG. 7B, the chips 6 held by themounting head 33 are mounted on four sets of electronic componentmounting positions 16 a of the board 16, which are set undernon-mounting conditions. As a result, as shown in FIG. 10D, the mountingoperations of the chips 6 onto eight pieces of the electronic componentmounting positions 16 a of the board 16 are accomplished. Then, whilethe chips 6 are mounted by this mounting head 33, the second camera 35is again transported over the chips 6 of the electronic componentsupplying unit 2, and such chips 6 which will be picked up in next timeare taken by the second camera 35.

[0092] Then, as shown in FIG. 9B, when the second camera 35 is evacuatedfrom the upper portion of this chip 6, the mounting head 33 istransported over the electronic component supplying unit 2, and thechips 6 are sequentially picked up by the four absorbing nozzles 33 c ofthe mounting head 33 based upon the positions of the chips 6 acquired bythe second recognition processing unit 56.

[0093] In conjunction with this operation, the first camera 34 istransported over the board 16 held by the first board holding mechanism10A of the board holding unit 10. Then, the first camera 34 issequentially transported in such a manner that the image acquisitionrange 18 sequentially surrounds four sets of right-sided electroniccomponent mounting positions 16 a among eight sets of the electroniccomponent mounting positions 16 a which are set to the board 16, andthen, this first camera 34 acquires an image of the image acquisitionrange 18.

[0094] Then, the image of the image acquisition range 18 taken by thefirst camera 34 is processed by the first recognition processing unit 55so as to investigate mounting conditions of the chips 6 in theelectronic component mounting positions 16 a of the board 16. After thisinvestigation of the mounting condition, the board 16 is brought outfrom the first board holding mechanism 10A to the boardreceiving/supplying unit 13, and a new board 16 is carried into thefirst board holding mechanism 10A.

[0095] Also, the first camera 34 which has completed the image takingoperation at the first board holding mechanism 10A is transported oversuch a board 16 held by the second board holding mechanism 10B, on whichthe chips 6 have not yet been mounted. At this plane, the first camera34 takes an image of such an electronic component mounting position 16 aon which the chips are subsequently scheduled to be mounted, so that aposition of the electronic component mounting position 16 a is detected,and also a coating condition of the adhesive agent 17 is investigated.

[0096] Subsequently, similar operations to the above-describedoperations are repeatedly carried out. In other words, in theabove-described electronic component mounting method, both the firstcamera 34 for taking an image of the board 16 and the mounting head 33for mounting thereon the chips 6 alternately access the board holdingunit 10, whereas both the second camera 35 for taking images of thechips 6 and the mounting head 33 for picking up the chips 6 alternatelyaccess the electronic component supplying unit 2. As a result, theoccurrence of loss time in the mounting operation can be avoided duringwhich none of works is carried out in both the board holding unit 10 andthe electronic component supplying unit 2.

[0097] In the electronic component mounting apparatus according to thisembodiment mode, an image of the board of the board holding unit 10 istaken by the first camera 34 so as to execute various sorts ofinvestigation/detection process operations by the first recognitionprocess unit 55 while utilizing such a time duration during which themounting head 33 performs the pick-up operation. Also, images of thechips 6 of the electronic component supplying unit 2 are taken by thesecond camera 35 in order to detect the positions of the chips 6 by thesecond recognition processing unit 56 while utilizing such a timeduration during which the mounting head 33 executes the mountingoperation. Alternatively, an image of the board of the board holdingunit 10 may be taken by the first camera 34 so as to execute varioussorts of investigation/detection process operations by the firstrecognition process unit 55 while utilizing such a time duration duringwhich the mounting head 33 performs the pick-up operation and the isscanning operations. Also, alternatively, images of the chips 6 of theelectronic component supplying unit 2 may be taken by the second camera35 in order to detect the positions of the chips 6 by the secondrecognition processing unit 56 while utilizing such a time durationduring which the mounting head 33 executes the mounting operation andthe scanning operation. Since such an alternative process operation iscarried out, temporal spare time may be produced in the image takingoperations by the first camera 34 and the second camera 35. As aconsequence, the stable operations of the electronic component mountingapparatus may be maintained.

[0098] Furthermore, since a plurality of chips 6 are picked up so as tobe mounted within a single mounting turn, a total transport distance ofeach of these beam members can be shortened, so that work efficienciescan be increased.

[0099] It should also be noted that both the coating conditioninvestigation and the mounting condition investigation are carried outin the electronic component mounting apparatus according to thisembodiment mode. Alternatively, either one or both of these coatingcondition/mounting condition investigation may be omitted during theelectronic component mounting operation.

[0100] In accordance with the present invention, while the electroniccomponent mounting apparatus is provided with the mounting headtransporting mechanism for transporting the mounting head whichmounts/transports the electronic component between the electroniccomponent supplying unit and the board holding unit; the first cameratransporting mechanism for transporting the first camera which takes animage of the board in the board holding unit over at least the boardholding unit; and the second camera transporting mechanism fortransporting the second camera which takes an image of the electroniccomponent of the electronic component supplying unit over at least theelectronic component supplying unit, since both the electronic componentsupplying unit and the board holding unit are defined as the range to betransported, and the mounting head, the first camera, and the secondcamera are relatively traveled in conjunction to each other, theoccurrence of loss time in both the electronic component supplying unitand the board holding unit can be avoided, and the tact time can beshortened to improve the work efficiency.

What is claimed is:
 1. An electronic component mounting method executedby an electronic component mounting apparatus comprising: a mountinghead for picking up an electronic component of an electronic componentsupplying unit to hold the picked electronic component, and for mountingsaid held electronic component on an electronic component mountingposition of a board held by a board holding unit; a mounting headtransporting mechanism for transporting said mounting head between saidelectronic component supplying unit and said board holding unit; a firstcamera for taking an image of the board held by said board holding unit;a first camera transporting mechanism for transporting said first cameraover at least said board holding unit; a first recognition processingunit for processing an image taken by said first camera so as to acquirean actual position of said electronic component mounting position of theboard held by said board holding unit; a second camera for taking animage of the electronic component of said electronic component supplyingunit; a second camera transporting mechanism for transporting saidsecond camera over at least said electronic component supplying unit; asecond recognition processing unit for processing an image of saidsecond camera so as to acquire a position of the electronic component ofsaid electronic component supplying unit; said electronic mountingmethod comprising: a first step in which said second camera istransported to said electronic component supplying unit by said secondcamera transporting mechanism to take an image of an electroniccomponent, and thereafter said second camera is evacuated from an upperarea of said electronic component by said second camera transportingmechanism; a second step in which an image taken by said second camerais processed by said second recognition processing unit so as to acquirea position of said electronic component; a third step in which whilesaid mounting head transporting mechanism executes a positioningoperation for positioning said mounting head to said electroniccomponent based upon the position of the electronic component acquiredby said second recognition processing unit, said electronic component ispicked up by said mounting head; a fourth step in which said firstcamera is transported by said first camera transporting mechanism over aboard held by said board holding unit so as to take an image of saidboard by said first camera, and thereafter said first camera isevacuated from an upper area of said board by said first cameratransporting mechanism; a fifth step in which the image taken by saidfirst camera is processed by said first recognition processing unit so ato acquire an actual position of said electronic component mountingposition of the board; and a sixth step in which while said mountinghead transporting mechanism executes a positioning operation forpositioning said mounting head to said electronic component mountingposition based upon the actual position of said electronic componentmounting position acquired by said first recognition processing unit,the electronic component held by said mounting head is mounted on saidelectronic component mounting position; wherein while said electroniccomponent held by the mounting head is mounted on said electroniccomponent mounting position, said second camera is again transportedover said electronic component supporting unit so as to take an image ofan electronic component which is subsequently picked up by said secondcamera.
 2. The electronic component mounting method according to claim1, wherein said first camera takes an image of the electronic componentmounting position of said board so as to acquire an image thereof insaid fourth step, and said first recognition processing unit processessaid image in order to acquire the actual position of said electroniccomponent mounting position in said fifth step.
 3. The electroniccomponent mounting method according to claim 1, wherein said firstcamera takes images of both said electronic component mounting positionand adhesive agent coated at said electronic component mounting positionso as to acquire images thereof in said fourth step, and wherein saidfirst recognition processing unit processes said acquired images inorder to acquire the actual position of said electronic componentmounting position and also to investigate a coating condition ofadhesive agent coated at said electronic component mounting position insaid fifth step.
 4. The electronic component mounting method accordingto any one of claim 1 to claim 3, wherein said electronic componentmounting method is further comprised of: a seventh step in which saidfirst camera transporting mechanism transports said first camera over anelectronic component mounting position of said board on which theelectronic component has been mounted so as to take an image of saidelectronic component mounting position; and an eighth step in which theimage taken in said seventh step is processed by said first recognitionprocessing unit so as to investigate a mounting condition of saidelectronic component.
 5. The electronic component mounting methodaccording to claim 4, wherein the subsequent fourth step is continuouslycarried out after said seventh step.
 6. An electronic component mountingmethod executed by an electronic component mounting apparatuscomprising: a mounting head for picking up an electronic component of anelectronic component supplying unit to hold the picked electroniccomponent, and for mounting said held electronic component on anelectronic component mounting position of a board held by a boardholding unit; a mounting head transporting mechanism for transportingsaid mounting head between said electronic component supplying unit andsaid board holding unit; a first camera for taking an image of the boardheld by said board holding unit; a first camera transporting mechanismfor transporting said first camera over at least said board holdingunit; a first recognition processing unit for processing an image takenby said first camera so as to acquire an actual position of saidelectronic component mounting position of the board held by said boardholding unit; a second camera for taking an image of the electroniccomponent of said electronic component supplying unit; a second cameratransporting mechanism for transporting said second camera over at leastsaid electronic component supplying unit; a second recognitionprocessing unit for processing an image of said second camera so as toacquire a position of the electronic component of said electroniccomponent supplying unit; said electronic mounting method comprising: afirst step in which said second camera is transported to said electroniccomponent supplying unit by said second camera transporting mechanism totake images of a plurality of electronic components, and thereafter saidsecond camera is evacuated from an upper area of said plural electroniccomponents by said second camera transporting mechanism; a second stepin which images taken by said second camera are processed by said secondrecognition processing unit so as to acquire positions of said pluralelectronic components; a third step in which while said mounting headtransporting mechanism executes a positioning operation for sequentiallypositioning said mounting head to said plural electronic componentsbased upon the positions of the plural electronic components acquired bysaid second recognition processing unit, said plural electroniccomponents are sequentially picked up by said mounting head; a fourthstep in which said first camera is transported by said first cameratransporting mechanism over a board held by said board holding unit soas to take an image of said board by said first camera, and thereaftersaid first camera is evacuated from an upper area of said board by saidfirst camera transporting mechanism; a fifth step in which the imagetaken by said first camera is processed by said first recognitionprocessing unit so a to acquire actual positions of said pluralelectronic component mounting positions of said board; and a sixth stepin which while said mounting head transporting mechanism executes apositioning operation for sequentially positioning said mounting head tosaid plural electronic component mounting positions based upon thepositions of said plural electronic component mounting positionsacquired by said first recognition processing unit, the pluralelectronic components held by said mounting head are sequentiallymounted on said plural electronic component mounting positions; whereinwhile said electronic components held by the mounting head aresequentially mounted on said plural electronic component mountingpositions, said second camera is again transported over said electroniccomponent supporting unit so as to take images of a plurality ofelectronic components which are subsequently picked up by said secondcamera.
 7. The electronic component mounting method according to claim6, wherein said first camera takes images of a plurality of electroniccomponent mounting positions of said board so as to acquire imagesthereof in said fourth step, and wherein said first recognitionprocessing unit processes said images in order to acquire the actualpositions of said plural electronic component mounting positions in saidfifth step.
 8. The electronic component mounting method according toclaim 6, wherein said first camera takes images of both said pluralelectronic component mounting positions and adhesive agent coated atsaid plural electronic component mounting positions so as to acquireimages thereof in said fourth step, and wherein said first recognitionprocessing unit processes said acquired images in order to acquire theactual positions of said plural electronic component mounting positionsand also to investigate coating conditions of adhesive agent coated atsaid plural electronic component mounting positions in said fifth step.9. The electronic component mounting method according to any one ofclaim 6 to claim 8, wherein said electronic component mounting methodfurther comprises: a seventh step in which said first cameratransporting mechanism transports said first camera over a plurality ofelectronic component mounting positions of said board on which theelectronic components have been mounted so as to take images of saidplural electronic component mounting positions; and an eighth step inwhich the images taken in said seventh step are processed by said firstrecognition processing unit so as to investigate mounting conditions ofsaid plural electronic components.
 10. The electronic component mountingmethod according to claim 9, wherein the subsequent fourth step iscontinuously carried out after said seventh step.